US AI-linked tech bond issuance hits $220 billion as credit spreads widen
WuBlockchain’s WhiteLine Daily said large US technology companies have issued about $220 billion in AI-related bonds so far this year through Aug. 10, up sharply from roughly $12.5 billion a year earlier. The report said big tech firms that had largely funded AI spending from internal cash flow are turning more heavily to debt markets to finance data centers and other infrastructure, and the added supply has started to push borrowing costs higher. Average spreads on tech corporate bonds have risen to 89 basis points, or 9 basis points above the broader US investment-grade market, according to the report. It added that some large new deals now need to offer higher yields to attract buyers. WhiteLine Daily’s takeaway was straightforward: AI capital expenditure has not run into a funding freeze, but money is getting more expensive. The report also highlighted other parts of the AI supply chain. Zayo expanded a long-term fiber supply agreement with Corning and plans to add about 24,000 kilometers of network by 2030, with more than 12,900 kilometers of long-haul fiber to be built with NVIDIA. In China, Eoptolink reported first-half revenue of 41.778 billion yuan and net profit attributable to shareholders of 13.651 billion yuan, while Yangtze Memory parent Changcun Holding saw its STAR Market IPO filing accepted, with a planned 33 billion yuan raise.





